FISCHER ELEKTRONIK ICK BGA 23X23 Heat Sink, For Ball Grid Array, BGA, PLCC, 23 �C/W, 6 mm, 23 mm, 23 mm Hoodman HEYENSG Cable Type Balanced/stereo 1/4" male

Cable Type Balanced/stereo 1/4" male to two stereo 1/4" female Y-cable Length 6" ( 15 cm ) Shielding Not specified Connector 1 1x stereo 1/4" male Connector 2 2x stereo 1/4" female Packaging Info Package Weight 0

Gain: 5 dBd

Tenba T488 TriPak - for Tripod

Tri start thread coupling mechanism (MIL-DTL-38999 series III type) with anti-decoupling device

This clip holds up to ten A5- or A4-sized paper sheets on the tablet for a natural pen and paper drawing experience when using the Wacom Finetip or Ballpoint Pen

FISCHER ELEKTRONIK ICK BGA 23X23 Heat Sink, For Ball Grid Array, BGA, PLCC, 23 �C/W, 6 mm, 23 mm, 23 mm Hoodman HEYENSG Cable Type Balanced/stereo 1/4" maleThe ICK BGA 23X23 is a 23 x 23 x 6mm Heat Sink made of aluminium with black anodized surface. This ICK series heat sink can be attached to recommended devices by thermal conductive adhesives and foils. This heat sink acts as a socket suitable for universal processors. 1. 8mm Plate thickness Applications Industrial Product details External Diameter Metric Packages Cooled BGA, PLCC Heat Sink Material Aluminium Thermal Resistance 23C W External Length